Solder wire is an alloy used in the electronics industry for soldering electronic components onto the printed circuit board or two pieces of metal. Solder can be leaded (Sn/Pb) or lead-free (with no lead). Both leaded and lead-free solder can be either flux cored (with flux in the core of the wire) or solid (with no flux in the core.) Solder flux is a kind of chemical used by electronic companies to clean surfaces of PCB before soldering electronic components onto the board. The main function of using flux in any circuit board assembly or rework is to clean and remove any oxide from the board prior to soldering. Solder flux helps to deoxidize metals (copper tracks on the PCB and leads of electronic components) and helps better soldering and wetting. In metallurgy, a flux (derived from Latin fluxus meaning “flow”) is a chemical cleaning agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time. They are used in both extractive metallurgy and metal joining.
When solder melts and forms a joint between two metal surfaces, it actually forms a metallurgical bond by chemically reacting with the other metal surfaces. A good bond requires two things, a solder that is metallurgically compatible with the metals being bonded and good metal surfaces, free of oxides, dust, and grime that prevent good bonding. Grime and dust can easily be removed by cleaning or prevented with good storage techniques. Oxides, on the other hand need another approach.
The Solder Wire market is expected to increase due to growth in GDP per-capita, international tourism, etc. The global Solder Wire market is expected to grow at a healthy rate during the forecast period (2018-2023). The growth is expected on account of many factors, such as an increase in disposable income, increasing international inbound and outbound tourism and aging demography. Global solder wire market is anticipated to grow at a CAGR of 5.6% by 2023. Global Solder Wires Market 2018 analyses the crucial factors of the Solder Wires market based on present industry situations, market demands, business strategies adopted by Solder Wires market players and their growth scenario.
Metal paste is mainly used to fill the dent over any metallic and solid surface and also for fixations of granites and other allied industries. Ready-to-use metal repair putty, dent filler and patching compound. Durable metal filler for fast, permanent repairs. A unique, quality problem-solver, Lab-metal ready-to-use repair compound spreads like paste and hardens quickly into metal. A metal paste, in which a filler mainly composed of metal is mixed with good dispersibility, is manufactured with good productivity at a low cost without generating a foil of the metal. A paste-like material (referred to as a paste material hereafter) containing a metal filler is fed into a gap between a pair of rotating whetstones which are relatively rotated while facing with each other having a specified gap there between, to pass and discharge therein. The paste material is thus kneaded and dispersed. In addition, the paste material is kneaded and dispersed by suppressing the generation of a metal foil, adjusting the gap to a specified interval dg and feeding the paste material into the interval while applying thereon a predetermined positive pressure and/or negative pressure.